Meeting the challenge of challenging environments
Electrolube epoxy resins are specialist systems for potting and encapsulating printed circuit boards (PCBs) and electronic components. Resin systems are designed to protect the device from harsh environments acting as a barrier against contaminates such as moisture, chemicals or physical shock and vibrations.More info > Download product selector chart > Download product brochure >
Formulated to exhibit excellent electrical and physical properties, Electrolube epoxy resin systems are created in order to protect the electronic device allowing it to operate in some of the harshest conditions, while in the process maintaining and enhancing performance.
Epoxy resins are generally much harder compounds than the other resin chemistries, once cured they offer superb mechanical and chemical protection. This makes them an ideal choice for some of the toughest applications such as the automotive, aerospace and marine industries.
Electrolube epoxy resins also exhibit excellent thermal properties, dissipating heat away from components
For More details on the Chemistry of Epoxy resins, have a look at our knowledge centre articles below:
Highly adhesive epoxy resin for adhesion or encapsulation.
Very low viscosity epoxy resin with excellent clarity.
Fast curing, low viscosity resin which is tough once cured.
High chemical resistant two-part epoxy resin with wide operating temperature range.
Two-part epoxy resin - flame retardant with excellent solvent resistance.
Medium viscosity, thermally conductive and flame retardant, two part encapsulating and potting compound
General purpose two part epoxy resin, flame retardant, encapsulating and potting compound
General purpose two part encapsulating and potting compound with high toughness.
Very low viscosity flame retardant resin two part potting and encapsulating compound
One-part epoxy resin suitable for dipping and glob-top
Highly thermally conductive epoxy, flame retardant, two part encapsulation compound
highly temperature resistant and thermally conductive potting compound
ER2223 black epoxy resin has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry.
ER2224 Epoxy potting compound is a highly thermally conductive resin (0.8 W/m*K) which also offers strong thermal cycling properties.
High temperature resistant, thermally conductive, two-part encapsulation compound based on epoxy technology
ER4002 is an ideal choice for automotive potting and encapsulation applications