Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.
  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.


Example of Mixing instructions for Encapsulation Resins


More Information

Encapsulation Resins

Epoxy

ER2218 - Black Epoxy Resin

ER2218
Black Epoxy Resin

250g resin pack - 5kg

Product code: ER2218RP250G - ER2218K5K


ER2218 is a low viscosity epoxy resin with excellent thermal stability. The product has been specifically designed for compatibility with reflow applications, therefore remaining stable for short term, high temperature excursions. The system utilises a hardener free of DDM or other aromatic amines. The flame retardant filler used is a non-halogenated 'clean' type leading to relatively low toxicity fumes and low smoke emission.

Its extremely low viscosity makes it a perfect choice for potting electronics which have complex geometries or limited spacing and operates over a very wide temperature range.


Key Properties:
  • Low viscosity
  • Flame retardant, meets UL94 V-0
  • Excellent high temperature stability
  • Ideal for applications involving thermal cycling or extreme temperatures for short periods of time, such as reflow applications

Additional information

Product data sheets
ER2218 (tds) Download

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